PhD Studentship - Vulcan – Vat photopolymerization on wafer printing University of Nottingham, Department of Engineering United Kingdom

PhD Studentship - Vulcan – Vat photopolymerization on wafer printing


Closing Date
Wednesday, 31st July 2019



PhD studentship Sponsored by Texas Instruments Incorporated (TI)


Based at the Centre for Additive Manufacturing (CfAM)


University of Nottingham 

This 3 year PhD studentship, is based at the world-renowned Centre for Additive Manufacturing (CfAM) at The University of Nottingham in partnership with global electronics manufacturer Texas Instruments Incorporated. For further information, please visit


Project title: Vulcan – Vat photopolymerization on wafer printing


Project description: 

Spin coating of photoactive polymers in conjunction with photolithography is extensively used in semiconductor fabrication. This technology is used both on the front end fab (i.e. integrated circuit fabrication) and back end packaging (e.g. redistribution layers). This process is inherently limited though to thin layers (<20 um in many cases) and rectangular geometries. Furthermore, if a thicker layer is desired it is not as simple as dispensing additional materials but instead requires multiple process steps before another layer can be added. As AM technologies advance and printed electronics (PE) applications continue to mature there will be a need to utilize vat photopolymerization as a method to expand the design space of polymer on wafer applications. 


This project is targeting the development of photoactive resin systems and processes for them that can be utilized to build arbitrary geometries onto silicon wafer surfaces. Expanding design parameters of polymer on wafer is anticipated to open up new avenues in both front and back end applications. For front end, there is the possibility of controlling etch/deposition rates and depths as wells the ability to vary designs across a single wafer. For back end, there are applications in terms of in-package stress reduction, die-to-die interconnects, in-package passives and many, many more applications. It is expected that through this project a new kind of paradigm concerning wafer level fabrication will be developed for next generation semiconductor devices.   


The successful candidate will:

  • Receive the training needed for a professional career in Additive Manufacturing and 3D printing 
  • Receive a full studentship (fees and stipend at UK/EU rates) for 3 years 
  • Work directly with leading academics and industrialists
  • Receive Travel and consumable allowance
  • International fees will be covered for overseas applicants



Applicants should possess a minimum 2:1 in Materials Science, Physics, Chemistry, Engineering, or a related discipline. 


How to apply


Please send your covering letter, CV and academic transcripts to referring to the project title. Please note applications without academic transcripts will not be considered.


The successful candidate will be available to start on 1st October 2019.


Closing date: 31st July 2019.

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